关键字：ENHANCED THERMAL-CONDUCTIVITY; CURING KINETICS; RESIN; COMPOSITES

摘要：With the rapid advancement of 5G and 6G technologies, the demand for high-performance epoxy-based thermal conductive composite materials has significantly increased. In this study, a novel bio-based bis-epoxy silane coupling agent (SiE2PG) was synthesized using pyrogallol as the starting material. By simply mechanical stirring, SiE2PG was incorporated with boron nitride (BN) particles and commercial epoxy resin E51 to fabricate SiE2PG/ BN/EP thermal conductive composites. The results demonstrated that, compared to the control sample without SiE2PG, the composite containing 10 parts of SiE2PG and 20 wt% BN exhibited an 81 % increase in storage modulus, a 26 degrees C rise in glass transition temperature, a 112 % enhancement in thermal conductivity, and an 18 % reduction in dielectric constant. Additionally, SiE2PG improved the interfacial adhesion between BN and epoxy resin via chemical bonding, significantly enhancing the thermal stability and insulation properties of the composites. These performance improvements indicate the great potential of SiE2PG in advanced applications of microelectronic packaging and contribute to the development of sustainable materials and cutting-edge packaging technologies.

卷号：332

期号：

是否译文：否