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薄圆柱体高频感应温度场的测量和有限元模拟

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  • Key Words:薄圆柱体;;热电偶;;测温;;有限元;;温度场模拟

  • Abstract:本文利用自制的NiCr-NiAl热电偶精确地测量了薄圆柱工件端面高频感应温度场的分布;应用有限元分析软件ANSYS/Thermal对高频感应加热过程的温度场进行了模拟。热电偶测量的数据直观可信,但测取工件温度场分布费时费力;有限元分析则可较为快速获知工件各处的温度,弥补了实验工作的不足。本文研究结果显示,两种方法得出的结果具有可比性,能够相互参照。

  • Issue:03

  • Translation or Not:no

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